半導體設備規格
Substrate:• Silicon Wafer
• GaAs, GaN
• InP, Ge, SiC
Soaking Function:
• Minimized Chemical Consumption
• Temperature Control Accuracy +1C
• Programable Soaking Time
Pressure Stripping:
• High Pressure Nozzle
• Aerodynamic Nozzle
• Steam Nozzle
• Backside Cushion
• （High Pressure Damage Free)
• Backside Clean
Final Clean & Dry:
• Double Side Clean
• Dry